ON-DEMAND WEBINAR
DFM for flex and rigid-flex PCBs utilizing surface mount technology
A webinar presented by Vern Solberg
A webinar presented by Vern Solberg
Abstract:
Developing a flexible circuit for surface mount component assembly entails a unique set of requirements. To quote a leading flexible circuit fabricator “Understanding how these requirements interact will allow the PCB designer to create a flex circuit that balances both electrical and mechanical features into a reliable, cost effective interconnect solution”. There are a broad number of reasons for developing the flexible and rigid-flex circuit;
• Increased wiring density- flexible circuits are capable of providing very narrow
conductors requiring only 25% of the space typically reserved for hard-wire
interconnect.
• SMT component interconnect- Land pattern features can be incorporated within the
flexible circuit pattern to accommodate the mounting and interconnecting both
passive and active surface mount components.
• Mechanical compliance- the thin base material is not only flexible but can be
shaped to fit unique and often complex 3D interconnect applications and enables
the inclusion of rigid materials when greater physical support is warranted.
Topics of discussion:
1. DfM principles for flexible and rigid-flex circuits
Establishing flex circuit construction types
Base materials for flexible and rigid flex
Cover coating and film variations
Conductor routing and physical feature planning
Flexible circuit bending and folding guidelines
EMI shielding and impedance control methodology
2. SMT component selection and land pattern development
Passive R and C devices
SOICs
QFN and QFP
BGA and CSP
3. DfM for SMT assembly processing
