SMALLER PAYLOADS SEE THE BIG BENEFITS OF HDI PCBs


Cube Sat Infographic

A basic cube satellite unit measures 10 x 10 x 10 cm and has a mass of around 1.33 kg. Due to their small size, cube satellites require the use of high-density interconnect technology, or HDI as we call it.


The use of HDI for the cube satellite market resolves several challenges, such as:

Intrinsic Limitations for High-Speed Communications
The cube satellites has the limited bandwidth resources which lead to high latency, low data rates, and eventual performance degradation. The demand for broader channel capacity is increasing for downloading the housekeeping and scientific data. Further, this is anticipated to limit the usage of the cube satellite for some high-speed communication applications.

Sensitivity to Stray Radiations
Is cube satellites are small in size and so are their electronic components which are more sensitive to stray radiations, this is expected to reduce the sampling capabilities of sensors. However, with all the precautions in place and coatings on surfaces, we can suppress the effects of the stray radiations.

Hardware Challenges
Hardware challenges such as miniaturization, power control, antenna design, delay tolerant networking and configurations are anticipated to limit the usage of the cube satellites. Moreover, their small form factor with limited access to solar energy is expected to increase system design challenges.


See What’s Inside



5 Chapters

52 Pages

10,000+ Downloads



1. OVERVIEW

    1.1 What is HDI?
    1.2 What is driving the increase preference for HDI PCBs?
    1.3 The cost of HDI
    1.4 What can go wrong?

2. THE KEY TO HDI PCB DESIGN SUCCESS

    2.1 The benefits of a planned approach
    2.2 Choose the right PCB material
    2.3 Have a plan for your PCB stack-up and microvia structure
          2.3.1 HDI stack-up classes
          2.3.2 Stacked vs staggered vias
    2.4 Key considerations in your HDI PCB design strategy

3. SIGNAL INTEGRITY FOR HDI

    3.1 Signal quality of one net
    3.2 Crosstalk noise
    3.3 The constraints of controlled impedance

4. MANUFACTURING FOR HDI

    4.1 Layers and laminations
    4.2 Mechanical vs laser drill
          4.2.1 Laser drilled microvias
    4.3 Hole fill process
    4.4 Drill-to-copper
    4.5 Landless via technology
    4.6 Surface finishes
    4.7 BGA breakout and fanout strategy
          4.7.1 Example of how to breakout a .4mm BGA
          4.7.2 Example of how to breakout a .5mm BGA

5. SIERRA CIRCUITS’ CAPABILITIES

    5.1 Sierra Circuits’ preferred materials
    5.2 Sierra Circuit’s HDI Stackup Planner online tool
    5.3 HDI Stackup Planner tutorial
    5.4 About Sierra Circuits

About Us

Sierra Circuits has been faithfully serving the aerospace industry since 1986. We specialize in HDI PCB design, manufacturing and assembly. We are qualified and certificated to build your IPC Class 3A boards, while handling all aspects of PCB production. We provide our customers with unprecedented quality, reliability, and a single point of support.



SierraCircuitsTextLogo.png     LinkedIn logo Instagram logo grey.png Facebook logo 
grey.png Twitter logo grey.jpg YouTube logo grey.png


© 2020 Sierra Circuits, Inc. | Terms of Use | Do Not Sell My Personal Information (CCPA Required) | Privacy Policy