High-Speed PCB Design Guide

High-Speed PCB Design Guide

In the present world, electronic products are transforming into more complex devices due to the increase in the component count on the PCB. This is making room for high-density and high-frequency of circuit operation. Typically, signal frequencies from 50MHz to as high as 3GHz are considered to be high-speed signals. In the future, the demand for high performance from devices such as computers, mobiles, and communication devices would require even higher speed of operation and higher component counts.

These requirements demand challenging PCB design skills. This book identifies the PCB design challenges and discusses the best practices to be implemented during PCB designing.

In the following sections, we will discuss the performance requirements such as signal integrity (SI), and related issues of controlled impedance (CI), power integrity (PI), and EMI/EMC. To achieve these performance requirements, we discuss how component placement, routing, stack-up design, and material selection is done for high-speed boards.


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20 Chapters
100 Pages
500+ Downloads



Introduction

PCB Design Flow for High-Speed Designs            

When Do You Call It a Complex Board?

Performance Characteristics      

Signal Integrity for PCB Designers           

          What  is Signal Integrity?             

          Need for Signal Integrity              

          Problems Encountered with High-Frequency Signals        

          What Leads to Signal Integrity Issues in a PCB?   

          Advantages of Differential Signaling        

          Common Mode Noise Tolerance              

Controlled Impedance

          What is Controlled Impedance?

          How to Control the Impedance?

          Errors to Avoid When Designing for Controlled Impedance           

          Controlled Impedance Design Checklist

          How to Design a Board with Controlled Impedance?       

          Common Mistakes to Avoid in a Stack-Up for Controlled
          Impedance

          How Sierra Circuits deals with Controlled Impedance      

          Failure Analysis

          Sierra Circuits Impedance Calculator       

PCB Transmission Line  

          What is a PCB Transmission Line?             

          When is an Interconnection to Be Treated as a Transmission
          Line?

Power Integrity

          What is Noise?

          What is Power Integrity?             

          What is Power Distribution Network (PDN)?       

          Managing Power Integrity           

          What is Target Impedance?        

          What are Decoupling Capacitors?             

          The Difference Between Signal Integrity and Power Integrity       

          Comparing Signal Integrity and Power Integrity

          How to Measure Power Integrity?           

          The Function of Power Integrity Tools    

EMI and Electromagnetic Compatibility (EMC)  

          Electromagnetic Compatibility (EMC)     

          What is EMC or EMI?     

          Sources of EMI

          Best PCB Design Practices for EMC           

Electrical Considerations for High-Speed and HDI            

Component Placement Strategy              

          Floorplanning   

          Component Placement Considerations  in High-Speed PCB           

          Termination Resistors   

          Orientation        

          Organization     

          Separating Analog and Digital Circuits     

          Ground Plane Isolation

High-Speed Routing Strategy    

Best Routing Practices for High-Speed Routing   

High-Speed Routing Tricks Tips  

Stack-Up Design              

          Construct of a Stack-Up

          Design of Stack-Up         

          Best Way to Do a Stack-Up for High-Speed Signals            

          Lamination Selection     

          Stack-Up Design Material Parameter Considerations       

          Planning High-Speed PCB Stack-Up         

Selecting High-Speed Materials

          PCB Material Categories              

          Signal Loss and Operating Frequency     

          Non-PTFE Materials       

          Stack-Up Guidelines for Mixed Materials              

          Hybrid Stack-Up Guidelines        

Footprint for High-Speed Boards             

          Component Footprint Shapes    

          Pad Shapes for High-Speed PCB Design  

          Via Shapes Considerations          

          Component Selection and Placement     

Vias      

          Blind and Buried Microvias          

          Microvias            

          Design tips for Traces, Vias, and Other PCB Components

Appendix           

High-Speed PCB Design Checklist            

Sierra Circuits Deliverables        

Sierra Circuits PCB Design Capabilities 

About Us

Sierra Circuits has been faithfully serving PCB designers and engineers since 1986, and has worked with over 20,000 customers since then. We specialize in PCB manufacturing and assembly and High-Density Interconnect technology. From PCB layout and design to assembly and manufacturing, Sierra Circuits handles all aspects of PCB production. We provide our customers with unprecedented quality, reliability, and a single point of support.



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