Introduction
PCB Design Flow for High-Speed Designs
When Do You Call It a Complex Board?
Performance Characteristics
Signal Integrity for PCB Designers
What is Signal Integrity?
Need for Signal Integrity
Problems Encountered with High-Frequency Signals
What Leads to Signal Integrity Issues in a PCB?
Advantages of Differential Signaling
Common Mode Noise Tolerance
Controlled Impedance
What is Controlled Impedance?
How to Control the Impedance?
Errors to Avoid When Designing for Controlled Impedance
Controlled Impedance Design Checklist
How to Design a Board with Controlled Impedance?
Common Mistakes to Avoid in a Stack-Up for Controlled
Impedance
How Sierra Circuits deals with Controlled Impedance
Failure Analysis
Sierra Circuits Impedance Calculator
PCB Transmission Line
What is a PCB Transmission Line?
When is an Interconnection to Be Treated as a Transmission
Line?
Power Integrity
What is Noise?
What is Power Integrity?
What is Power Distribution Network (PDN)?
Managing Power Integrity
What is Target Impedance?
What are Decoupling Capacitors?
The Difference Between Signal Integrity and Power Integrity
Comparing Signal Integrity and Power Integrity
How to Measure Power Integrity?
The Function of Power Integrity Tools
EMI and Electromagnetic Compatibility (EMC)
Electromagnetic Compatibility (EMC)
What is EMC or EMI?
Sources of EMI
Best PCB Design Practices for EMC
Electrical Considerations for High-Speed and HDI
Component Placement Strategy
Floorplanning
Component Placement Considerations in High-Speed PCB
Termination Resistors
Orientation
Organization
Separating Analog and Digital Circuits
Ground Plane Isolation
High-Speed Routing Strategy
Best Routing Practices for High-Speed Routing
High-Speed Routing Tricks Tips
Stack-Up Design
Construct of a Stack-Up
Design of Stack-Up
Best Way to Do a Stack-Up for High-Speed Signals
Lamination Selection
Stack-Up Design Material Parameter Considerations
Planning High-Speed PCB Stack-Up
Selecting High-Speed Materials
PCB Material Categories
Signal Loss and Operating Frequency
Non-PTFE Materials
Stack-Up Guidelines for Mixed Materials
Hybrid Stack-Up Guidelines
Footprint for High-Speed Boards
Component Footprint Shapes
Pad Shapes for High-Speed PCB Design
Via Shapes Considerations
Component Selection and Placement
Vias
Blind and Buried Microvias
Microvias
Design tips for Traces, Vias, and Other PCB Components
Appendix
High-Speed PCB Design Checklist
Sierra Circuits Deliverables
Sierra Circuits PCB Design Capabilities